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Some tips for PCB power wiring

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  The capacitance of the bypass ceramic capacitor should not be too large, and its parasitic series inductance should be as small as possible. Multiple capacitors in parallel can improve the impedance characteristics of the capacitor. The parasitic parallel capacitance of the inductor should be as small as possible, and the distance between the solder pads of the inductor leads should be as far as possible. Avoid placing any power or signal wiring on the ground layer. The area of the high-frequency loop should be minimized as much as possible. The placement of vias should not disrupt the path of high-frequency current on the ground layer. A small common circuit on the system board requires different grounding layers, and the grounding layer of the small common circuit is connected to the power grounding layer by a single point. The drive circuit loop from the control chip to the upper and lower field effect transistors should be as short as possible. The power circuit and control...